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Process Equipment

Temperature-Controlled Process EquipmentPrecision ovens & thermal equipment

Vacuum, nitrogen, clean, and high-temperature oven platforms for industrial process validation.

  • Vacuum and inert atmosphere options
  • Stable temperature control
  • Project-ready configuration

Thermal Process Equipment

Shortlist ovens, chambers, aging rooms, and plasma cleaning equipment by temperature range, atmosphere control, cleanliness, volume, and process scenario.

安胜 ESC-VO 系列真空烘箱-1

ESC-VO125-T6

ESC-VO125-T6 Vacuum Oven

ESC-VO125-T6 Vacuum Oven is designed for vacuum drying and thermal processing. Published configuration: Internal Chamber Dimensions: 500*500*500 mm; Operating Temperature Range: A:Room temperature+25~200℃;B:Room temperature+35~300℃;C:Room temperature+45~400℃;D:Room temperature+50~500℃;E:Room temperature+60~600℃.
安胜 ESC-NO 系列氮气烘箱-1

ESC-NO100-T6

ESC-NO100-T6 Nitrogen Oven

ESC-NO100-T6 Nitrogen Oven is designed for nitrogen-atmosphere thermal processing. Published configuration: Internal Chamber Dimensions: 500*400*500 mm; Operating Temperature Range: 25~600 ℃.
安胜 ESC-PCO 系列压力烘箱-1

ESC-PCO288-T2

ESC-PCO288-T2 Pressure Oven

ESC-PCO288-T2 Pressure Oven is designed for thermal processing under pressure. Published configuration: Internal Chamber Dimensions: 600*800*600 mm; Operating Temperature Range: 25~250 ℃.
安胜 ESC-LCO 系列无尘无氧化烘箱-1

ESC-LCO100-T5

ESC-LCO100-T5 Clean Non-Oxidation Oven

ESC-LCO100-T5 Clean Non-Oxidation Oven is designed for clean heating under a controlled atmosphere. Published configuration: Internal Chamber Dimensions: 500*500*400 mm; Operating Temperature Range: 25~500 ℃.

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Process Application Solutions

Match ovens, chambers, aging rooms, and plasma cleaning equipment to semiconductor packaging, battery, electronics, and medical device workflows.

Semiconductor Packaging

Application

Semiconductor Packaging

ESSENSCIEN equipment supports semiconductor packaging workflows with practical temperature, vacuum, nitrogen, clean heating, and process control options.
Biomedical Devices

Application

Biomedical Devices

ESSENSCIEN equipment supports biomedical devices workflows with practical temperature, vacuum, nitrogen, clean heating, and process control options.
Electronics Manufacturing

Application

Electronics Manufacturing

ESSENSCIEN equipment supports electronics manufacturing workflows with practical temperature, vacuum, nitrogen, clean heating, and process control options.
New Energy Batteries

Application

New Energy Batteries

ESSENSCIEN equipment supports new energy batteries workflows with practical temperature, vacuum, nitrogen, clean heating, and process control options.

Selection and Process Knowledge

Connected articles, FAQs, and glossary entries for oven selection, vacuum/nitrogen control, cleanliness class, and temperature uniformity.

Article

Vacuum Oven Selection Guide

For a quotation, provide wet-load mass, moisture or solvent type, container depth and batch endpoint; ask the supplier to state gauge units and pump configuration. Check sample and tray contact with heated surfaces. Heat transfer changes at low pressure, so the sample core can still be warming after the controller reaches setpoint.

Article

Oxygen Free Drying Strategy Battery

Low oxygen and low moisture are separate endpoints: an acceptable chamber oxygen reading does not prove acceptable electrode moisture, so include post-drying transfer and packaging in trials. Define the oxygen sampling location, analyser delay and calibration method. Test with a real load and after door opening; supply-gas purity cannot substitute for chamber oxygen measurements.

Article

Nitrogen Vacuum Oven Selection

Compare oxygen-reduction curves at the same load and sampling location, including hold, cooling and recovery after door opening, rather than comparing only minimum oxygen readings. Define the oxygen sampling location, analyser delay and calibration method. Test with a real load and after door opening; supply-gas purity cannot substitute for chamber oxygen measurements.

Article

High Temperature Oven 600c Selection

For a 600°C process, request usable-workspace, loaded temperature-spread and over-temperature protection records at the target temperature, and confirm conditions for unloading after cooling. Place sensors for the thermal load of parts, fixtures and trays; record ramp overshoot, stable hold and cooling. Use an empty-chamber curve only as a baseline.

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