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Key points for selecting metal terminal anti-oxidation heat treatment equipment：Distinguish terminal oxidation from cleaning residue and judge the effect through later soldering or contact performance. Confirm the sequence of evacuation, nitrogen admission and heating, and whether the circulation fan can operate in vacuum mode. Screen pressure-sensitive samples on a small load first.

Validation and risk control of low-oxygen curing process for polymer materials：For polymers, examine colour, cure extent and embrittlement and check whether the material permits low-oxygen curing. Check oxidation and moisture regain during cooling and unloading, together with exhaust routing, gas-supply failure response and site ventilation.

Nitrogen storage process verification and risk control for sensitive devices：For device storage, check moisture regain after opening and unloading and record storage duration and external packaging conditions. Accept oxygen level, time to reach it and hold-stage stability separately; record nitrogen purity, supply pressure and consumption.

Battery material inert atmosphere treatment process verification and risk control：For battery materials, separate oxygen control from moisture testing and record exposure during transfer after drying. Define the oxygen sampling location, analyser delay and calibration method. Test with a real load and after door opening; supply-gas purity cannot substitute for chamber oxygen measurements.

Key points for selecting battery material inert atmosphere treatment equipment：For battery materials, separate oxygen control from moisture testing and record exposure during transfer after drying. Define the oxygen sampling location, analyser delay and calibration method. Test with a real load and after door opening; supply-gas purity cannot substitute for chamber oxygen measurements.

Low oxygen curing window establishment process verification and risk control：For a low-oxygen curing window, compare cure extent and interface results at different oxygen states and confirm the material endpoint. Define the oxygen sampling location, analyser delay and calibration method. Test with a real load and after door opening; supply-gas purity cannot substitute for chamber oxygen measurements.

Key points for selecting equipment for establishing low-oxygen curing windows：For a low-oxygen curing window, compare cure extent and interface results at different oxygen states and confirm the material endpoint. Define the oxygen sampling location, analyser delay and calibration method. Test with a real load and after door opening; supply-gas purity cannot substitute for chamber oxygen measurements.

Oxygen reduction time optimization process verification and risk control：For oxygen-reduction time, compare complete curves with the same load, initial oxygen state and supply conditions. Confirm the sequence of evacuation, nitrogen admission and heating, and whether the circulation fan can operate in vacuum mode. Screen pressure-sensitive samples on a small load first.