Total 4 items
Category:Non Oxidizing OvenClear
ESC-IGO100-T6
ESC-IGO211-T6
ESC-IGO423-T6
ESC-IGO640-T6
Model comparison
Filter by sample dimensions, loading method and temperature requirements. Optional equipment is listed separately in each product’s details.
| Model | Chamber dimensions | Operating temperature range | Details and configuration |
|---|---|---|---|
| ESC-IGO100-T6 | 500*500*400 mm | 25~600 ℃ | View configuration |
| ESC-IGO211-T6 | 650*650*500 mm | 25~600 °C | View configuration |
| ESC-IGO423-T6 | 650*650*1000 mm | 25~600 ℃ | View configuration |
| ESC-IGO640-T6 | 800*800*1000 mm | 25~600 ℃ | View configuration |
Equipment applications
The ESSENSCI IGO series addresses anti-oxidation heat treatment for display panel assemblies, semiconductors and specialized electronic components. Non-oxidizing describes the desired material outcome; it does not mean the chamber is absolutely oxygen-free. Define temperature, oxygen content and total treatment time from the permissible surface changes.
Also known as: Anti-oxidation oven, Low-oxygen heat treatment oven
For metal terminals and precision metal parts, first specify evaluation criteria for color, surface condition or subsequent processing. Select the atmosphere window from before-and-after results, rather than equating a particular oxygen value directly with an acceptable surface.
Large display panel assemblies require attention to both surface oxidation and heating at different locations. Use actual supports and loads to validate circulation paths, gas exchange and cooling.
Semiconductors and specialized electronic components have different structures and material combinations. Check the temperature limits and atmosphere requirements of each material, and include heating, holding and cooling before unloading in one validation procedure.
Selection and acceptance
Provide material composition, surface treatment, initial condition, temperature and permissible degree of oxidation. Where low-oxygen holding is required, agree an oxygen measurement method and include hold time and the cooling endpoint in acceptance conditions.
The published IGO configuration includes nitrogen filtration and flow control. Evaluate an oxygen analyzer, multipoint temperature monitoring and communication interfaces as needed. Specify gas supply conditions, sampling location and instrument calibration.
HEPA filtration and rapid cooling are options to evaluate and must be confirmed for temperature, load and process. Low-oxygen performance does not establish particle-control performance. If both are critical criteria, also compare the LCO series.
Frequently asked questions
No. Non-oxidizing generally describes the process objective of controlling material oxidation. Suitability depends on the material, temperature, time, atmosphere and cooling process, and should be judged from measurement profiles together with sample results.
Also compare usable loading capacity, atmosphere management, circulation, oxygen measurement and cooling conditions. Different materials or process cycles may require different arrangements at the same temperature. Evaluate them with the same samples and endpoints.
Set separate acceptance criteria for particles and oxidation, then evaluate the corresponding IGO options or the LCO clean non-oxidizing series. Confirm filtration, low-oxygen holding and their combined performance at operating temperature.
These names often describe a requirement to reduce oxidation; they do not mean that absolutely no oxygen is present inside the equipment. Provide the material, treatment temperature, permissible oxygen content and surface evaluation method, then compare gas circuits, seals, monitoring and cooling. Select IGO by anti-oxidation process requirements; check vacuum or cleanliness configurations separately when required.
First determine whether oxidation occurred during heating, holding, cooling or after removal. Then check gas purity, chamber sealing, measurement location and actual workpiece temperature. Load obstruction, surface residues and door-opening temperature can also affect results. Analyze the oxygen profile together with surface records from before and after treatment.
Specify whether timing begins at door closure, the start of nitrogen supply or program startup. Agree the oxygen measurement location and holding conditions after the target is reached. Use representative loads for acceptance and also record flow, gas supply conditions and recovery after door opening to compare the actual production cycle times of different arrangements.
Different alloys, coatings, surface residues and thermal masses change oxidation and heating behavior. Before processing them together, check permissible temperatures, outgassing and cross-contamination, and inspect the surfaces of representative workpieces separately. The same chamber oxygen content and temperature settings do not necessarily produce the same part results.
Process knowledge
ESSENSCI · Process consultation
Tell us your material, sample dimensions, batch quantity and target temperature. We will discuss equipment selection with you based on atmosphere, loading and site conditions.
Share your use case and we will provide selection recommendations.
