Total 3 items
Category:Pressure OvenClear
ESC-PCO96-T2
ESC-PCO288-T2
ESC-PCO640-T2
Model comparison
Filter by sample dimensions, loading method and temperature requirements. Optional equipment is listed separately in each product’s details.
| Model | Chamber dimensions | Operating temperature range | Details and configuration |
|---|---|---|---|
| ESC-PCO96-T2 | 400*600*400 mm | 25~250 ℃ | View configuration |
| ESC-PCO288-T2 | 600*800*600 mm | 25~250 ℃ | View configuration |
| ESC-PCO640-T2 | 800*1000*800 mm | 25~250 ℃ | View configuration |
Equipment applications
The ESSENSCI PCO series addresses pressure curing requirements for IGBT power modules, communication modules, MEMS and advanced encapsulation materials. Positive-pressure curing and vacuum degassing differ in purpose and operating conditions. Whether to evacuate first, when to pressurize and when to depressurize should be determined from the material formulation and sample results. Applying pressure must not be taken as proof that bubbles have been removed.
Also known as: Pressure curing oven, Pressure curing chamber
For capillary underfill (CUF), compare temperature, the timing of pressure application and changes in material viscosity. Inspect cured voids and interface condition using the agreed method, rather than judging treatment effectiveness from the pressurization step alone.
Bubbles from different sources can arise during epoxy mixing, dispensing and curing. First establish material working life and the curing window, then arrange degassing and pressure stages and inspect samples after depressurization.
Fixtures and the thermal mass of power modules and large electronic assemblies affect heat-up. Validate actual temperatures inside the module or at representative locations, while checking how pressure changes affect the assembly structure and encapsulation interfaces.
Selection and acceptance
Provide the pressurizing medium, operating pressure, pressure units and reference basis, pressure ramp rate, temperature and pressure hold times, and depressurization conditions. The material formulation defines the process window; evaluate it using actual encapsulated samples.
The PCO vacuum pump is optional. Specify whether pre-degassing is required, the target vacuum and the operating sequence. Positive-pressure capability cannot replace vacuum capability, and vacuum capability does not establish suitability for positive-pressure curing.
Confirm control logic for operating pressure, door locking, overtemperature and abnormal shutdown, and agree the conditions for opening after cooling and depressurization. Acceptance should review temperature-pressure profiles together with sample inspection results such as voids and interfaces.
Frequently asked questions
They generally cannot be substituted directly. Vacuum degassing promotes gas release, while pressure changes bubble volume and the curing environment. The appropriate sequence varies with the material and package structure and should be established through sample trials.
No universal guarantee can be made. Entrained gas from mixing, material viscosity, flow paths, cure rate and the pressure program all affect results. Agree an inspection method and permissible void criteria, and evaluate the finished product after depressurization.
Sample dimensions, batch mass, fixture layout, material curing window, operating pressure, cycle-time target and whether vacuum is required are also needed. Usable loading capacity and temperature-pressure transition times jointly affect throughput.
A pressure curing oven primarily provides pressurized heat treatment. For equipment described in purchasing as a vacuum pressure oven, confirm whether vacuum pretreatment and its pump system are included. The PCO vacuum system is optional. List the targets, sequence and acceptance conditions for the vacuum and positive-pressure stages separately in the quotation request, rather than treating them as one capability.
IGBT molding compounds and capillary underfill (CUF) adhesives differ in flow, gelation and curing windows. Obtain the material's process requirements first, then set pressure application timing, temperature ramp, holding and depressurization conditions, using the appropriate void and interface inspection methods. Using the same equipment does not mean that the same recipe can be reused.
First distinguish silver paste drying, curing and sintering requirements, then confirm the temperature, atmosphere and pressure specified for the material. Ordinary silver paste curing cannot be equated directly with pressure-assisted sintering. Compare PCO, nitrogen or clean oven series according to the formulation, matching the equipment's temperature-pressure range and the material endpoints individually.
Provide encapsulation materials, adhesive-layer dimensions, fixture layout, batch size and production cycle requirements. Agree temperature-pressure profiles, workpiece temperature measurement locations and void or interface inspection methods. During acceptance, also check the execution conditions for pressurization, depressurization, cooling and door-opening interlocks, and verify whether recording functions are included in the selected configuration.
Process knowledge
ESSENSCI · Process consultation
Tell us your material, sample dimensions, batch quantity and target temperature. We will discuss equipment selection with you based on atmosphere, loading and site conditions.
Share your use case and we will provide selection recommendations.
