Knowledge Hub

Key points for selecting 1000L cavity full load verification equipment：For a 1000 L loaded test, place sensors for actual tray layers and part mass and compare stability time and temperature spread. Verify that the actual load does not block circulation paths; for thermal-shock-sensitive materials also check ramp rates and temperature gradients within the sample.

Large load temperature difference management process verification and risk control：For heavy loads, examine core temperature delay and cooling rate and determine the complete cycle from sample curves. Define control accuracy and temperature uniformity separately. Controller-sensor fluctuation cannot represent the difference between locations in the usable workspace.

Key points for selecting large load temperature difference management equipment：For heavy loads, examine core temperature delay and cooling rate and determine the complete cycle from sample curves. Define control accuracy and temperature uniformity separately. Controller-sensor fluctuation cannot represent the difference between locations in the usable workspace.

Multi-layer tray drying cycle process verification and risk control：For multilayer trays, count accepted output per layer and examine upper, lower and return-air path differences. Place sensors for the thermal load of parts, fixtures and trays; record ramp overshoot, stable hold and cooling. Use an empty-chamber curve only as a baseline.

Key points for selecting multi-layer pallet drying rhythm equipment：For multilayer trays, count accepted output per layer and examine upper, lower and return-air path differences. Place sensors for the thermal load of parts, fixtures and trays; record ramp overshoot, stable hold and cooling. Use an empty-chamber curve only as a baseline.

For panels and long assemblies, check support arrangements and thermal distortion; measure adhesive-layer, edge and centre temperatures, ensuring fixtures do not block circulation. Place sensors for the thermal load of parts, fixtures and trays; record ramp overshoot, stable hold and cooling. Use an empty-chamber curve only as a baseline.

PCB coating and curing process verification and risk control：For PCB coatings, examine board-centre and edge temperatures, coating cure and heat-sensitive components. Place sensors for the thermal load of parts, fixtures and trays; record ramp overshoot, stable hold and cooling. Use an empty-chamber curve only as a baseline.

Key points for selecting PCB coating and curing equipment：For PCB coatings, examine board-centre and edge temperatures, coating cure and heat-sensitive components. Place sensors for the thermal load of parts, fixtures and trays; record ramp overshoot, stable hold and cooling. Use an empty-chamber curve only as a baseline.