Knowledge Hub

Lead frame cleaning and drying process verification and risk control：For lead frames, inspect residual moisture in hidden areas, surface particles and later bonding, fixing the post-cleaning delay. Confirm the sequence of evacuation, nitrogen admission and heating, and whether the circulation fan can operate in vacuum mode. Screen pressure-sensitive samples on a small load first.

Validation and risk control of encapsulant curing and defoaming process：Assess encapsulant degassing and curing separately to avoid vacuum foaming or premature curing during potting. Check oxidation and moisture regain during cooling and unloading, together with exhaust routing, gas-supply failure response and site ventilation.

Key points for selecting encapsulant curing and defoaming equipment：Assess encapsulant degassing and curing separately to avoid vacuum foaming or premature curing during potting. Check oxidation and moisture regain during cooling and unloading, together with exhaust routing, gas-supply failure response and site ventilation.

Power device stress relief process verification and risk control：For power-device stress relief, use warpage or stress measurements and confirm the actual sample-temperature curve. Accept oxygen level, time to reach it and hold-stage stability separately; record nitrogen purity, supply pressure and consumption.

Ceramic substrate heat treatment process verification and risk control：For ceramic substrates, check support, warpage and thermal shock and assess a furnace if the process exceeds the oven range. Define the oxygen sampling location, analyser delay and calibration method. Test with a real load and after door opening; supply-gas purity cannot substitute for chamber oxygen measurements.

Key points for selecting ceramic substrate heat treatment equipment：For ceramic substrates, check support, warpage and thermal shock and assess a furnace if the process exceeds the oven range. Define the oxygen sampling location, analyser delay and calibration method. Test with a real load and after door opening; supply-gas purity cannot substitute for chamber oxygen measurements.

Multi-point temperature distribution acceptance process verification and risk control：For multipoint acceptance, fix the usable workspace and sensor coordinates before comparing temperatures over the same stable interval. Place sensors for the thermal load of parts, fixtures and trays; record ramp overshoot, stable hold and cooling. Use an empty-chamber curve only as a baseline.

Key points for selecting multi-point temperature distribution acceptance equipment：For multipoint acceptance, fix the usable workspace and sensor coordinates before comparing temperatures over the same stable interval. Place sensors for the thermal load of parts, fixtures and trays; record ramp overshoot, stable hold and cooling. Use an empty-chamber curve only as a baseline.